集成电路科学与工程学院（示范性微电子学院）
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| 导师代码： |
10188
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| 导师姓名： |
张继华
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| 性 别： |
男 |
| 特 称： |
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| 职 称： |
教授
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| 学 位： |
工学博士学位
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| 属 性： |
专职 |
| 电子邮件： |
jhzhang@uestc.edu.cn
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| 学术经历：
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1998年7月毕业于兰州大学物理系。
2001年毕业于中国空间技术研究院兰州物理研究所（航天510所）获硕士学位(师从孙亦宁研究员)。
2004年毕业于中科院上海微系统与信息技术研究所获博士学位(师从半导体材料专家王曦院士)。
2004年8月加入电子科技大学，现为电子薄膜与集成器件国家重点实验室&集成电路学院教授/博导。
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| 个人简介：
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博士，电子科技大学教授，博士生导师，TGV3.0 提出者，电子薄膜与集成器件国家重点实验室微波介质与集成器件团队负责人。主要从而后摩尔时代集成电路关键材料与集成技术研究。作为项目负责人承担国家重点研发计划等国家级重大重点科研项目10 余项，科研经费逾亿元。荣获“全国创新争先奖牌”、四川省技术发明奖、广东省电子信息科学技术奖等国家、省部级奖励4 项，获授权发明专利50 余项。近年来作为TGV（玻璃通孔）三维集成技术的倡导者与引领者，带领团队率先开展TGV三维集成技术研究与产业化，并建立起国际上唯一同时具有晶圆级和面板级TGV生产能力的中试产线，服务世界科技前沿、国家重大需求和国民经济建设。作为新质生产力代表受到央视、人民日报等主流媒体报道。
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| 科研项目：
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近五年主持科研项目10余项，其中国家级重大重点项目3项：
(1) 国家级重点项目：XXXX SIP关键技术研究与应用，2024.7.1-2026.6.30，主持，1182万元
(2) 国家级重点项目，三维集成XXXX制备及XXXX应用技术研究，2022.11-2025.11，主持，经费1000万元
(3) 国家级重点项目，三维集成TGV XXXX研究，2022-2024年，主持，经费550万元
(4) 国家级项目， XXXX TGV集成及高效散热技术，2023.6-2024.10，主持，经费300万元
(5) 国家级项目，基于XXXX基板的XXXX集成技术，2022.01-2024.12，主持，经费56万元
(6) 国家级项目，XXXX及其XXXX技术研究，2018.06-2020.11，主持，经费460万元
(7) 国家级项目，XXX用低损耗XX玻璃转接板，2018.01-2020.12，主持，经费496万元
(8) 国家级项目，XXX相互作用机制研究，2023-2025年，经费382万元
(9) 国家级项目，XXX集成技术，2023.6-2025.5，经费400万
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| 研究成果：
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1. 获奖：
(1) 2017年，功能薄膜与集成器件团队，“全国创新争先奖牌”，2017年3月，（中国科协、科技部、人社部、国务院国资委）
(2) 2018年，薄膜无源集成关键技术及应用，2017年度四川省技术发明三等奖（排名第一），四川省人民政府，颁奖日期：2018.5
(3) 2019年，钙钛矿结构铁电材料的光伏效应及机理研究，2018年重庆市自然科学奖三等奖，重庆市人民政府，颁奖日期：2019.9
(4) 2022年，薄膜无源集成关键技术攻关及产业化，2022年广东省电子学会科学技术奖二等奖，颁奖日期：2023.1
2. 代表性论文（2020年起）
(1) Zhen Fang, Jihua Zhang*, Jinxu Liu, Ding Wen, Libin Gao, Hongwei Chen, Xingzhou Cai, Zhihua Tao, Wanli Zhang, Noise Coupling and Shielding Structures for Glass Core Substrate, IEEE Electron Device Letters, 2025, 46(1): 84-87
(2) Wenlei Li, Jihua Zhang*, Zhihua Tao, Libin Gao, Hongwei Chen, Lingyue Wang, Lei Zhao, Xingzhou Cai, Yong Li, Dongbin Wang, Shuang Li, Ting Liu, Wanli Zhang, Glass-Based Single-Layer Slow-Wave SIW Filter with Embedded Composite Right/Left-Handed Resonator, IEEE Transactions on Microwave Theory and Techniques(TMTT), 2025, 73(2): 1105-1116
(3) Zhen Fang, Jihua Zhang*, Yujian Cheng, Shuqi Li, Jinxu Liu, Xiaolin Yang, Libin Gao, Hongwei Chen, Wenlei Li, Xingzhou Cai, Modeling and Analysis of Parasitic Parameters of Through-Glass Vias with Various Tapers and Sidewall Roughness, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024, 14(12): 2300-2308
(4) Zhen Fang, Jihua Zhang*, Jinxu Liu, Hongwei Chen, Libin Gao, Xiaolin Yang, Wenlei Li, Xingzhou Cai, Huan Guo, Analysis and Optimization of Sidewall Roughness on Microwave Performance of Through-Glass Vias in 3-D Integrated Circuits, IEEE Transactions on Microwave Theory and Techniques, 2024, 72(1): 54-63
(5) Wenlei Li, Jihua Zhang*, Lingyue Wang, Libin Gao, Hongwei Chen, Zhen Fang, Xingzhou Cai, Yong Li, Layout Optimization of Integrated Inductors and Capacitors Using TGV Technology, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024, 14(1): 106-113
(6) Zhen Fang, Jihua Zhang*, Libin Gao, Shuqi Li, Jinxu Liu, Hongwei Chen, Xiaolin Yang, Wenlei Li, Xingzhou Cai, Closed-Form Expressions of Parasitic Parameters for Different Sidewall Roughness of Through-Silicon Vias Interconnects, IEEE Transactions on Electron Devices, 2024, 71(2): 1160-1165
(7) Wenlei Li, Jihua Zhang*, Libin Gao, Hongwei Chen, Lingyue Wang, Zhen Fang, Xingzhou Cai, Yong Li, Compact TGV-Based Bandpass Filters Using Integrated Dual Composite Right/Left-Handed Resonators, IEEE Transactions on Circuits and Systems II-Express Briefs, 2024, 74(4): 1939-1943
(8) Sheng Qu, Jihua Zhang *, Libin Gao *, Hongwei Chen, Yao Ding, Effect of Deposition Pressure and Temperature on Tungsten Thin-Film Heater for Phase-Change Switch Applications, Micromachines, 2024, 15(5): 576
(9) Miao Wang, Jihua Zhang*, Libin Gao, Hongwei Chen, Wenlei Li, Juefeng Fu, Lei Zhao, Dongbin Wang, Shuang Li, Ting Liu, Xingzhou Cai, Yong Li, Bin Peng, Wanli Zhang, Effect of heat treatment processes on the Cu-electrodeposited through glass vias (TGV) plate, Journal of Alloys and Compounds, 2024, 997: 174928
(10) Zhen Fang, Jihua Zhang*, Libin Gao, Shuqi Li, Jinxu Liu, Hongwei Chen, Xiaolin Yang, Wenlei Li, Xingzhou Cai, Yujian Cheng, Derivation and Analysis of a Hemispherical Physical Model and the Correction Factors for the Sidewall Roughness of Through-Glass Vias, IEEE Transactions on Microwave Theory and Techniques, 2024, 72(7): 3908-3919
(11) Sheng Qu, Jihua Zhang*, Linbin Gao*, Hongwei Chen, Jiamei Wang, Shuaishuai Fu, Minhao Liu, Yao Ding, Study on Resistance of Crystalline GeTe Thin Films and Enhancement on Electrical Properties of Phase Change Switch, IEEE Transactions on Electron Devices, 2024, 71(7): 4102-4111
(12) Zhen Fang, Jihua Zhang*, Jinxu Liu, Juefeng Fu, Shuqi Li, Xinzhou Cai, Libin Gao, Hongwei Chen, Wenlei Li, Exploration and Analysis of Through-Glass Vias for High-Speed, Low-Loss Vertical Interconnects in Glass-Based 3-D Integrated Circuits, IEEE Transactions on Electron Devices, 2024, 71(7): 4267-4274
(13) Zhen Fang, Jihua Zhang*, Jinxu Liu, Shuqi Li, Libin Gao, Hongwei Chen, Xingzhou Cai,Wenlei Li, Study of Mutual Crosstalk between Hemispheres in Roughness Hemispherical Model, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024, 14(11): 2132-2135
(14) Jinxu Liu, Jihua Zhang*, Zhen Fang, Hongwei Chen, Libin Gao, Wenlei Lin, Tianpeng Liang, Wanli Zhang, Investigating the Tapered Profiles on the Parasitic Inductance of Through-Silicon Vias, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024, 14(11): 2128-2131
(15) Zhen Fang, Jihua Zhang*, Juefeng Fu, Jinxu Liu, Libin Gao, Hongwei Chen, Wenlei Li, Xingzhou Cai, Comprehensive Analysis and Application of Laser Bonding Technology for Glass-Based Integrated Sensors, IEEE Sensors Journal, 2024, 24(21): 35580-35589
(16) Lingyue Wang, Hongwei Chen*, Wenlei Li, Jihua Zhang*, Libin Gao, Xingzhou Cai, Zhen Fang, Yong Li, Yong Zhu, Rui Zhang, A 28-GHz Compact Substrate-Integrated Waveguide Bandpass Filter With Defected Ground Structure Using TGV Technology, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023, 13(12): 2008-2015
(17) Lingyue Wang, Hongwei Chen*, Wenlei Li, Libin Gao, Xingzhou Cai, Zhen Fang, Yong Li, Yong Zhu, Rui Zhang, Jihua Zhang*, A Low-Loss Slow Wave SIW Bandpass Filter with Blind Via-Holes Using TGV Technology, IEEE Microwave and Wireless Components Letters, 2024, 34(3): 271-274
(18) Sheng Qu, Linbin Gao*, Jiamei Wang, Hongwei Chen, Jihua Zhang*, A Review on Material Selection Benchmarking in GeTe-Based RF Phase-Change Switches for Each Layer, Micromachines, 2024, 15(3): 380
(19) Lingyue Wang, Hongwei Chen*, Wenlei Li, Libin Gao, Xingzhou Cai, Yong Li, Jihua Zhang*, Slow-Wave Substrate Integrated Waveguide with Low Loss and Miniaturized Dimensions Using TGV Technology, IEEE Electron Device Letters, 2024, 45(4): 681-684
(20) Xiaobing Jili, Libin Gao*, Jinxu Liu, Minghao Liu, Bowen Deng, Hongwei Chen, Jihua Zhang*, The Study of BMN cubic pyrochlores based multi-layer capacitors, Ceramics International, 2024, 50(14): 24960-24969
(21) Haohong Xie, Hongwei Chen*, Haolun Fu, Tianpeng Liang, Libin Gao, Bowen Deng, Jihua Zhang*, Structural and performance variations of aluminoborosilicate glass substrates with mixed alkaline earth effect for applications in 3D integrated packaging, Ceramics International, 2024, 50(20), Part A: 38089-38095
(22) Haohong Xie, Hongwei Chen*, Libin Gao, Ting Jiang, Zhiqiang Wang, Jihua Zhang*, The effect of SiO2 nano-powders on energy storage properties of the PLZST antiferroelectric ceramics, Ferroelectrics, 2024, 618(3): 789-798
(23) WenLei Li, Jihua Zhang*, Libin Gao, Hongwei Chen, Zhen Fang, Xingzhou Cai, Weicong Jia, Huan Guo, Yong Li, Wideband analysis and prolongation of surrounding TGVs shielding structure in 3-D ICs, IEEE Microwave and Wireless Technology Letters, 2023, 33(1): 39-42
(24) Zhen Fang, Jihua Zhang*, Libin Gao, Hongwei Chen, Wenlei Li, Xingzhou Cai, Weicong Jia, Huan Guo, Yong Li, Ka-Band Broadband Filtering Packaging Antenna based on Through Glass Vias (TGVs), Frontiers of Information Technology & Electronic Engineering, 2023, 24(6): 916-926
(25) Jinxu Liu, Jihua Zhang*, Libin Gao, Hongwei Chen, Extracting and Analyzing the S-Parameters of Vertical Interconnection Structures in 3D Glass Packaging, Micromachines, 2023, 14(4): 803
(26) Wenlei Li, Jihua Zhang*, Lingyue Wang, Libin Gao, Hongwei Chen, Zhen Fang, Xingzhou Cai, Weicong Jia, Huan Guo, General Analytical Method for Investigating Parasitic Characteristics of Through Glass Vias (TGVs) in 3-D Integration, IEEE Transactions on Electron Devices, 2023, 70(9): 4554-4559
(27) Zhen Fang, Jihua Zhang*, Yuhua Guo, Libin Gao, Hongwei Chen, Jinxu Liu, Xingzhou Cai, Wenlei Li, Huan Guo, Enhancing Glass-to-Glass Bonding at Room Temperatures Using Laser Surface Modification with Ti/Cu/Ti/TiO2 Thin Films, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023, 13(9): 1502-1509
(28) Zhen Fang, Jihua Zhang*, Libin Gao, Hongwei Chen, Xiaolin Yang, Jinxu Liu, Wenlei Li, Xingzhou Cai, Absorptive Filtering Packaging Antenna Design Based on Through-Glass Vias, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023, 13(11): 1817-1824
(29) Guanyu Zhou, Libin Gao*, Yuzhe Chen, Hongwei Chen, Wenlei Li, Chao Zhang, Jinxu Liu, Jihua Zhang*, High Inductance Density Glass Embedded Inductors for 3-D Integration, IEEE Microwave and Wireless Technology Letters, 2023, 33(6): 679-682
(30) Libin Gao*, Minhao Liu, Sheng Qu, Jinxu Liu, Shuaishuai Fu, Yao Ding, Hongwei Chen, Jihua Zhang*, Nano-scanning calorimetry applied to phase change processes in GeTe thin films, IEEE Transactions on Electron Devices, 2023, 70(8): 4128 - 4132
(31) Shuaishuai Fu, Libin Gao*, Yu Peng, Sheng Qu, Jiamei Wang, Hongwei Chen, Ningchuan Liu, Jihua Zhang*, Novel four-port RF phase change switches based on GeTe thin film, Journal of Micromechanics and Microengineering, 2023, 33: 095004
(32) Yuzhe Chen, Jihua Zhang*, Libin Gao*, Siyue Zou, Kexin Liang, Zhongzhe Liu, Zhen Fang, Hongwei Chen, Qinyan Ye, An optimized Ni–P seed layer coating method for through glass via (TGV), Microelectronic Engineering, 2022, 257: 111735
(33) Hang Shao, Libin Gao*, Kexin Liang, Hongwei Chen, Jihua Zhang*, Qinyan Ye, The effect of (Ni2+ + Sr2+) co-doping on structure and dielectric properties of Bi1.5MgNb1.5O7 pyrochlores, Materials Science & Engineering B-Advanced Functional Solid-State Materials, 2022, 277: 115571
(34) Libin Gao*, Kexin Liang, Zhipu Guan, Zhongzhe Liu, Zhen Fang, Hongwei Chen, Jihua Zhang*, Disordered Structures and Dielectric Properties of Ni-Doped Bismuth Magnesium Niobate Pyrochlores, The Journal of Physical Chemistry C, 2021, 125(50): 27793-27799
(35) Zhen Fang, Libin Gao, Hongwei Chen*, Bowen Deng, Xiaobing Jili, Wenlei Li, Tianpeng Liang, Sheng Qu, Yuzhe Chen, Kexin Liang, Jihua Zhang*, 3D Interdigital Electrodes Dielectric Capacitor Array for Energy Storage Based on Through Glass Vias, Advanced Materials Technologies, 2022, 2101530(1-8)
(36) Jiamei Wang, Libin Gao*, Sheng Qu, Hongwei Chen, Jihua Zhang*, The study of NiCr/GeTe ohmic contacts in the GeTe film based directly heated phase change switch, Vacuum, 2022, 200: 111015
(37) Ting Jiang, Hongwei Chen*, Libin Gao, Yuchong Hui, Bowen Deng, Zhen Fang, Jing Zhou, Jihua Zhang*, The Ba(Mg1/3Ta2/3)O3 ceramic based X-band filter, Materials Science & Engineering B, 2022, 280: 115681
(38) Hong Chen, Hongwei Chen*, Libin Gao, Jinyu Zhao, Jianming Wang, and Jihua Zhang*, Energy storage properties of (Pb, Sm, La)(Zr, Sn, Ti)O-3 antiferroelectric ceramics with SrTiO3 modified, Journal of Materials Science: Materials in Electronics, 2022, 33(10): 7718-7727
(39) Hong Chen, Hongwei Chen*, Libin Gao, Bowen Deng, Jihua Zhang*, Effect of boron doping on energy storage performance of PLZST ceramics, Ferroelectrics, 2022, 589: 152-160.
(40) Libin Gao*, Kexin Liang, Zhipu Guan, Zhongzhe Liu, Zhen Fang, Hongwei Chen, Jihua Zhang*, Structure dependence of dielectric properties in Ca-doped bismuth magnesium niobite pyrochores, Journal of Alloys and Compounds, 2022, 922: 165859
(41) Kexin Liang, Libin Gao*, Hongwei Chen, Zegao Wang, Qinyan Ye, Jihua Zhang*, Effect of Co2+ substitutions on microstructure and dielectric properties of Bi 1.5MgNb1.5O7 cubic pyrochlore, Journal of Electroceramics, 2022, 49: 6-14
(42) Tianpeng Liang, Jihua Zhang*, Hongwei Chen, Libin Gao, Sheng Qu, Haolin Zhao, Vincent G. Harris, Influence of Exposure Energy and Heat Treatment Conditions on Through-Glass Via Metallization of Photoetchable Glass Interposers, Ceramics International, 2021, 47(1): 1277-1283
(43) Tianpeng Liang, Jihua Zhang*, Hongwei Chen, Libin Gao, Vincent G. Harris, Dielectric and thermodynamic properties of Ba-doped photoetchable glasses for three dimensional RF microsystem packaging, Ceramics International, 2021, 47(10), part A: 14226-14232
(44) Tianpeng Liang, Jihua Zhang*, Hongwei Chen, Libin Gao, Sheng Qu, Vincent G. Harris, Impact of Alkaline Earth Oxides on Dielectric Properties of Photoetchable Glasses as Interposers for Integrated Circuits Packaging, Journal of Alloys and Compounds, 2021, 874: 159546
(45) Siyue Zou, Jihua Zhang*, Libin Gao, Jinyu Zhao, Hongwei Chen*，Energy storage properties of PLZST ceramics with tetragonal/orthogonal two-phase coexistence, Materials Science & Engineering B-Advanced Functional Solid-State Materials, 2021, 273: 115381
(46) Xueping Yu, Zhongzhe Liu, Xiya Yang,Yudi Wang, Jihua Zhang, Jialong Duan, Liming Liu, and Qunwei Tang, Crystal-Plane Controlled Spontaneous Polarization of Inorganic Perovskite toward Boosting Triboelectric Surface Charge Density, ACS Applied Materials & Interfaces, 2021, 13(22), 26196-26203
(47) Kexin Liang, Libin Gao*, Zhen Fang, Zhongzhe Liu, Zhipu Guan, Hongwei Chen, Jihua Zhang*, Effects of Ni2+ substitution on structure and dielectric properties of Bi1.5MgNb1.5O7 cubic pyrochlore, Journal of the European Ceramic Society, 2021, 41(6): 3425-3431
(48) Yunfei Zhu, Hongwei Chen*, Meng Wei, Libin Gao, Jinyu Zhao and Jihua Zhang*, Energy storage and dielectric properties of PLZST-based antiferroelectric ceramics, Ferroelectrics, ISSN: 0015-0193, 2021, 572: 1-12
(49) Chuanjie Zhou, Hongwei Chen*, Libin Gao, Jinyu Zhao, Tianpeng Liang, Jihua Zhang*, Effect of Zr:Sn ratio in the PBLZST ceramic thick films on the energy storage characteristics, Journal of Materials Science: Materials in Electronics, 2021, 32: 9400-9411
(50) Zhongzhe Liu, Libin Gao, Kexin Liang, Zhen Fang, Hongwei Chen, Jihua Zhang*, Effect of external electric field on crystalline structure and dielectric properties of Bi1.5MgNb1.5O7 thin films, Chinese Physics B, 2021, 30(10): 107703
(51) Libin Gao*, Kexin Liang, Zhipu Guan, Zhongzhe Liu, Zhen Fang, Hongwei Chen, Jihua Zhang*, Disordered Structures and Dielectric Properties of Ni-Doped Bismuth Magnesium Niobate Pyrochlores, The Journal of Physical Chemistry, 2021, 125(50): 27793-27799
(52) Lei Chen, Jihua Zhang*, Hongwei Chen, Libin Gao, Tianpeng Liang, Haolin Zhao，Enhanced mechanical properties of Li2O-Al2O3-SiO2 photostructurable glass by SrO doping, Journal of Electronic Materials, 2020, 49(1): 705-711
(53) Tianpeng Liang, Jihua Zhang*, Hongwei Chen, Libin Gao, Gongwen Gan, Sheng Qu, Chongsheng Wu, Vincent G. Harris, Effect of Al2O3 on structural dynamics and dielectric properties of lithium metasilicate photoetchable glasses as an interposer technology for microwave integrated circuits, Ceramics International, 2020, 46(11): 18032-18036
(54) Tianpeng Liang, Jihua Zhang*, Hongwei Chen, Libin Gao, Gongwen Gan, Sheng Qu, Chongsheng Wu, Vincent G. Harris, Effect of B-doping, UV exposure and thermal annealing on dielectric properties and crystallization behavior of Li-Al-Si photoetchable glasses, Ceramics International 2020, 46(18): 28108-28113
(55) Xueping Yu, Yudi Wang, Jihua Zhang, Jialong Duan, Xiya Yang, Liming Liu, Qunwei Tang, Halogen Regulation of Inorganic Perovskites toward Robust Triboelectric Nanogenerators and Charging Polarity Series, Journal of Materials Chemistry A, 2020, 8(28): 14299-14307
(56) Yanhua Wu, Yudi Wang), Jialong Duan, Xiya Yang, Jihua Zhang, Liming Liu, Qunwei Tang, Cluster effect of additives in precursors for inorganic perovskites solar cells, Electrochimica Acta, 2020, 331: 135379
(57) Zhen Fang, Libin Gao, Hongwei Chen*, Kexin Liang, Zhongzhe Liu, Zhipu Guan, Jihua Zhang*, XPS study of probing evidence for displacive disorder in Ni-doped bismuth magnesium niobate pyrochlore, Materials Science & Engineering B-Advanced Functional Solid-State Materials, 2020, 259: 114601
3. 发明专利：
(1) 邹思月，张继华，方针，高莉彬，陈宏伟，王文君，蔡星周，穆俊宏，一种三维MIM电容器的制备方法，ZL 202010651339.3
(2) 陈雨哲，张继华，高莉彬，陈宏伟，一种XXXX金属种子层制备的方法，****专利：ZL 202018003569.X
(3) 方针、陈宏伟、高莉彬、张继华、陈雨哲、曲胜、邹思月、王文君，蔡星周，穆俊宏，玻璃盲孔加工方法，ZL 202010654067.2
(4) 张继华，刘钟喆，陈宏伟，高莉彬，一种表面等离子体活化改善玻璃基板BCB键合的方法，ZL 202110324614.5
(5) 方针、陈宏伟、高莉彬、张继华、陈雨哲、曲胜、邹思月、王文君，蔡星周，穆俊宏，玻璃转接板深孔侧壁附着层真空旋涂装置，ZL 202010654983.6
(6) 魏猛，张继华，陈宏伟，高莉彬，反铁电材料体系的异质堆叠多层陶瓷电容器的制备方法，ZL 201911238394.3
(7) 魏猛，张继华，陈宏伟，高莉彬，一种多层微晶玻璃电容器及其制备方法，ZL 201911238426.X
(8) 刘明浩，张继华，高莉彬，陈宏伟，一种基于碲化锗相变开关的可重构滤波器，ZL 202310261175.7
(9) 张继华，郑懿，陈宏伟，吴开拓，超宽可调谐振器，ZL 201710302990.8
(10) 张继华，陈建男，郑懿，陈宏伟，一种基于可调电容的可调谐振腔，ZL 201710086921.8
(11) 张继华，张鹏，陈宏伟，石玉龙，一种基于衰减量补偿的宽带衰减器，ZL 201510445807.0
(12) 张继华，魏猛，刘剑峰，黄家鹏，陈宏伟，一种纳米TiO2与绝缘玻璃复合材料及其制备方法，ZL 201510349393.1
(13) 张继华，刘剑峰，魏猛，陈宏伟，杨传仁，一种玻璃/陶瓷纳米复合材料的制备方法，ZL 201510573672.6
(14) 张继华，唐新宇，陈宏伟，杨传仁，一种厚膜电阻浆料及其制备方法， ZL 201510270966.1
(15) 张继华，王磊，魏猛，陈宏伟，杨传仁，一种碲基复合薄膜及其在MIM电容中的应用，ZL 201410479808.2
(16) 杨传仁，张巧真，张继华，陈宏伟，赵强，用于刻蚀微波介质薄膜的刻蚀液及制备方法， ZL 201110455998.0
(17) 杨传仁，张琴，张继华，陈宏伟，基于不锈钢基板的YBCO厚膜电阻浆料及其制备方法，ZL201010158934.X
(18) 杨传仁，杨莉军，陈宏伟，张继华，薄膜电路产品基片处理方法，ZL200810304256.6
(19) 杨传仁，张瑞婷，张继华，陈宏伟，一种高温加热的真空蒸发镀膜装置，ZL200810044995.6
(20) 杨传仁，张瑞婷，张继华，陈宏伟，用于刻蚀BST薄膜的腐蚀液及制备方法，ZL200810045321.8
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| 专业研究方向：
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| 专业名称 |
研究领域/方向 |
招生类别 |
| 140100集成电路科学与工程 |
02纳电子科学与集成电路制造工程 |
博士学术学位 |
| 085400电子信息 |
02纳电子科学与集成电路制造工程，04纳电子科学与集成电路制造工程（非全） |
博士专业学位 |
| 140100集成电路科学与工程 |
01微纳电子材料与器件，04封装与微系统集成 |
硕士学术学位 |
| 085403集成电路工程 |
01微纳电子材料与器件，04封装与微系统集成 |
硕士专业学位 |
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